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We specialize in the design and fabrication of Metal Core Printed Circuit Boards (MCPCB) with Chip on Board (COB) technology. Our manufacturing facility in DongGuan, China have a dedicated staff working with decades of accumulated expertise in the field of Thermal Management. Our MCPCB can be designed and constructed in different types from Single Layer to Multi Layer. From Flexible to Rigid formats. Our Aluminium Laminate Board's high thermal conductive insulation layer enables 10 times more efficient Thermal conductivity than FR-4, Polymide and other materials. |
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